Semiconductor production capacity drives the equipment and materials industry to meet the golden period of development

"Driven by new demand, domestic semiconductor equipment (manufacturing) is entering the golden period of development." On September 26, the 2017 China IC Industry Development Seminar and the 12th China IC Manufacturing Annual Conference opened in Nanjing Zhao Jinrong, president of North Huachuang, said. According to statistics, by 2020, more than 40% of the newly planned fab projects in the world will be settled in China, which will bring huge investment opportunities. The mobile Internet has spurred continued growth in the chip market, and the new fab boom is bringing new opportunities to semiconductor device manufacturers, especially domestic manufacturers. According to the data, a new production line with an annual output of 50,000 pieces of the most advanced 12-inch wafer production line needs to invest 45 billion yuan, of which equipment investment accounts for more than 75%. According to statistics, by 2020, there will be 62 new fabs in the world, 26 of which will be located in China, accounting for 42%, which brings opportunities for domestic semiconductor equipment manufacturers. "By 2020, the market for chip-only devices will reach 30 billion to 40 billion US dollars." Yin Zhiwei, chairman and CEO of China Micro Semiconductor, expects that the etching and chemical thin film equipment of Zhongwei Semiconductor will have good Market prospects. “We have statistics from 2016 to 2020, with a total investment of US$99.8 billion and a semiconductor equipment investment of US$74.8 billion. Among them, plasma etching equipment investment is about US$13.47 billion, and the micro-etching machine can be divided equally. According to Zhao Jinrong, North China’s semiconductor equipment includes 14nm logic process equipment solutions, 8/12-inch advanced packaging process equipment solutions, and 6/8-inch microelectromechanical systems (MEMS)/compound semiconductor processes. Equipment solutions, etc. Among them, the 14-nanometer Hardmask PVD (hard mask physical vapor deposition) equipment independently developed by North Huachuang has successfully entered the international mainstream integrated circuit production line verification. This is after the North China Huachuang's 14nm etching machine and single-chip annealing equipment. A class of 14-nanometer IC devices entered the process validation phase. In addition, North Huachuang has become the largest PV and LED equipment manufacturer in China and continues to receive large orders. One point to emphasize is that semiconductor equipment is a highly concentrated industry, and only the best companies have a chance to make a profit. "In the equipment industry, only the top three or even the top two can be considered successful. What North China can do is to continue research and development, improve quality and improve service." Zhao Jinrong said. “Market Opportunities + Government Support, New Demands for New Plants and Mature Process Plants provide a rare opportunity for domestic equipment to enter the market.” Some industry insiders commented. Correspondingly, China's semiconductor materials market has huge space. "Our company is committed to the development of high-end packaging solder balls, the rapid development of the domestic semiconductor industry, so that we have full confidence in the material market." Participants from Shanghai Xinhuajin Welding Materials Technology Co., Ltd. told reporters. With the development of semiconductor technology, the importance of material technology is more prominent. In particular, mobile Internet devices require more and more chips. At the same time, the big data-driven storage market is growing, the display market is expanding, and new markets such as VR/AR and smart cars are expanding. The demand in these end markets is driving the development of new technologies such as advanced processes, 3D and OLEDs from 10 to 7 nanometers. Materials are the key to the realization of these new technologies. Among the A-share companies, Shanghai Xinyang is the domestic wafer-level chemical leader, and electroplating fluids and other products are the first to break the foreign monopoly. The company also participates in the 300mm large silicon wafer project and layout photoresist. Jiangfeng Electronics' metal sputtering targets have grown rapidly and have been delivered in volume at the 16nm technology node.

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