The survival of LED package under the impact of new technology

In the wake of the emergence of chip-scale packaging (CSP) technology, many are wondering whether it will replace traditional packaging methods. Xiao Xiaoming, CTO of Ruifeng Optoelectronics, shared his insights—“CSP may reduce some concerns about traditional packaging, but its arrival is definitely going to impact the existing package forms, especially in older product lines and high-power products like ceramic power packages.” With over 20 years of experience in packaging technology, Xiao has transitioned from a self-deprecating engineer into a key player in the industry. He believes that “CSP is undeniably a future trend, but its market penetration and share might not be as significant as some expect. Since CSP doesn’t use a bracket or substrate, and phosphor coating could involve liquid phosphor, fluorescent glue, or solid-state films, the equipment investment required for this new approach may also change.” Xiao also highlighted that with the rise of CSP, chips seem to jump directly into the luminaire. This raises questions about potential short circuits, whether chip manufacturers and packaging factories will shift from partners to competitors, and how they should collaborate. He emphasized, “This market won’t be monopolized. CSP isn’t an exclusive advantage of chip companies. Packaging firms may not be worse at CSP than chip manufacturers. They have extensive customer networks, while chip companies can provide CSP solutions. The packaging company then turns it into a module for downstream customers.” It’s worth noting that as LED lighting becomes more standardized, the form of modules derived from packaging and their applications will shape the industry. The U.S. Department of Energy (DOE) predicted that LED package costs would drop sixfold between 2012 and 2020. However, Xiao believes achieving this goal without a revolutionary technological breakthrough—just through material improvements or efficiency gains—will be difficult. LED packaging has evolved from inline LEDs to high-power LEDs, PLCCs, ceramic packages, EMC packages, and now CSPs. The development of these technologies has always been driven by the price-to-performance ratio (lm/$). According to Xiao, the progress in LED technology is largely due to advancements in materials. From PPA and PCT materials to ceramics, and more recently, EMC and SMC technologies, material properties such as refractive index, heat resistance, and UV resistance have improved significantly, greatly influencing overall product performance. Key technologies affecting LED packaging include solid-welding techniques, from early silver-gel crystallization to eutectic bonding; wire bonding, from gold wires to flip-chip without gold wires; and phosphor coating methods, from dispensing to patterned coating and remote excitation. In Xiao’s view, the evolution of these technologies will reshape manufacturing processes and equipment investments. As the demographic dividend fades, the most significant shift in the packaging line may be automation. Additionally, product standardization, production efficiency, and capital scale will become central to the industry. In conclusion, Xiao stated that market demand and technological innovation are the two main drivers of industrial growth. The evolution of technology has always focused on cost-performance, with cost being the top priority. New technologies will inevitably impact the traditional packaging industry, and in the end, LED packaging will become a low-margin sector where success depends on capital, scale, and management.

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Quartz glass is made by melting a variety of pure natural quartz (such as crystal, quartz sand, etc.). The coefficient of linear expansion is extremely small, which is 1/10-1/20 of ordinary glass, and has good thermal shock resistance. It has high heat resistance, often used at temperatures between 1100 and 1200 degrees Celsius, and short-term temperatures of up to 1400 degrees Celsius. Quartz glass is mainly used in laboratory equipment and refining equipment for special high-purity products. Because of its high spectral transmission, it is not damaged by radiation (other glass will be dark after being irradiated by radiation), so it is also an ideal glass for spacecraft, wind tunnels and spectrophotometer optical systems.

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